Year: 2024
Type: article
Abstract: Traditional power devices packaging have been low package ratio, and difficult highly about the characteristic of the integrated, can't to adapt to the high integration and high density development trend in the semiconductor packaging industry; In this paper, a new design of Al wire cleaver face, can form a plane on the surface of Al wire or ribbon, realize the second die bond or wire bond on the surface of point. Through the process to achieve the idea that it can be applied to power devices of MCP packaging technology.
Author: Steven Pan
Institution: Jiangsu University of Science and Technology
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4404865082