Work

Research on Integrated Circuit Package Inspection Based on Machine Vision

Year: 2024

Type: conference-paper

Source: International Conference on Cyber Security and Information Engineering (ICCSIE)

DOI: 10.1145/3689236.3696043

Authors: Feilong Jiang, Kai Meng

Institution: Ningbo Polytechnic

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405011475

FWCI: 0.721

Cites: 19

Cited by: 1

Related to: 10