Work

Noncontact Integration of Photonic IC and Electronic IC via Inductively Coupled Interconnects

Year: 2024

Type: article

Abstract: This letter presents an innovative noncontact packaging technique for photonic integrated circuits (PICs) and electronic integrated circuits (EICs) through inductively coupled interconnects. The primary aim of this approach is to enhance thermal isolation between the heat-generating electrical logic die and the thermally sensitive optical interferometer die. The feasibility of this contactless transceiver, which fulfills information transmission from the laser Doppler vibrometry (LDV) to the EIC, is substantiated via electromagnetic simulations. Furthermore, thermal simulations conducted by COMSOL prove that this packaging configuration could potentially reduce the temperature of PICs by up to$4.6~^{\circ }$C when compared to the conventional 3-D stack packaging, underlining its potential for improved thermal performance.

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3511042

Authors: Tongchuan Ma, Liyiming Yang, Yanlu Li, Yuan Du

Institutions: Nanjing University, Ghent University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

Funders: National Natural Science Foundation of China, Fonds Wetenschappelijk Onderzoek