Work

Polymer-Based Electronic Packaging Molding Compounds, Specifically Thermal Performance Improvement: An Overview

Year: 2024

Type: article

Source: ACS Applied Polymer Materials

DOI: 10.1021/acsapm.4c03086

Authors: Xiaohan Li, Jiateng Huang, Yawen Chen, Feiyu Zhu, Yepeng Wang, Wei Wei, Yakai Feng

Institutions: Tianjin University, Jiangnan University, Key Laboratory of Synthetic and Biological Colloids, Ministry of Education

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405113764

FWCI: 5.921

Cites: 157

Cited by: 44

Related to: 10