Work

Preparation of Thermally Conductive Die Attach Adhesive and Its Application in High-power Lighting LED Packaging

Year: 2024

Type: article

Source: Polymer(Korea)

DOI: 10.7317/pk.2024.48.5.485

Authors: Huimei Yao, Tao Wang, Jiaojiao Fu, Shenghua Pei, Jingrui Zhu, Cao Feng, Shiming Guo, Jiaxin Wang, Kai Li

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405213387

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