Interfacial Discharge Characteristics and Insulation Life Analysis of Package Insulation Under Square Voltage Coupled With High Frequency and Steep dv/dt
Year: 2024
Type: article
Authors: Wei Wang, Qingmin Li, Daocheng Lu, Yujie Tang, Jian Wang, Hanwen Ren, Ruoqing Hong
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405220019
