Work

Rigorous simulation for impact of wafer topography on critical dimension

Year: 2024

Type: conference-paper

Source: International Workshop on Advanced Patterning Solutions (IWAPS)

DOI: 10.1117/12.3053050

Authors: Zhicheng Liu, 辉曾, Fangyi Shi, Yue Li, Xiaohui Pan, Jinbo Liu

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405236036

FWCI:

Cites: 1

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Related to: 10