Work

Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules

Year: 2024

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2024.3516534

Authors: Yuan Gao, Kai Yin, Claus Leth Bak, Asger Bjørn Jørgensen, Zichen Zhang, Hongbo Zhao, Stig Munk-Nielsen, Christian Uhrenfeldt, Thore Stig Aunsborg

Institutions: Aalborg University, Hangzhou City University, Virginia Tech

Language: English

Topic: High voltage insulation and dielectric phenomena

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Poul Due Jensens Fond (Grundfos Foundation), Aalborg Universitet

OpenAlex ID: W4405304107

FWCI: 1.042

Cites: 36

Cited by: 11

Related to: 10