Work

Research on the Effect of Heating Temperature Rise on the Reliability of CSOP Solder Joints

Year: 2024

Type: conference-paper

Source: International Symposium on Semiconductor and Electronic Technology (ISSET)

DOI: 10.1109/isset62871.2024.10779749

Authors: Xue Li, Tuo Qin, Yunpeng Qu, Peng Chen

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405305208

FWCI: 0.781

Cites: 3

Cited by: 1

Related to: 10