Work

Study on Thermal Resistance Performance of Press-Pack IGBT Modules

Year: 2024

Type: conference-paper

Source: International Symposium on Semiconductor and Electronic Technology (ISSET)

DOI: 10.1109/isset62871.2024.10779907

Authors: Kai Ma, Qing GUo, Yangyi Shen, Hai Lin, Junming Zhang, Ying Li, Yue Quan, Lingqi Tan

Institutions: Zhejiang University, Guangdong Power Grid Company (China)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405305289

FWCI: 0.806

Cites: 8

Cited by: 1

Related to: 10