Work

Multi-Variable Analysis of Current Carrying Characteristics and Solder Joint Thermal Stress in TSV Structures of Integrated Circuits

Year: 2024

Type: conference-paper

Source: International Symposium on Semiconductor and Electronic Technology (ISSET)

DOI: 10.1109/isset62871.2024.10779708

Authors: Junlan Yue, Feijie Huang, Jiahe Wang, Qiulei Hu, Zhijie Ruan, Yonghu Ma

Institution: Yanbian University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405305545

FWCI:

Cites: 11

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Related to: 10