Work

Research on wafer warping monitoring based on digital twin

Year: 2024

Type: conference-paper

Source: International Conference on Testing Technology and Automation Engineering (TTAE)

DOI: 10.1117/12.3055454

Authors: Pingyu Zhu, Hengzhen Liu, Fumin Xie

Institution: Guangzhou University

Language: English

Topic: Digital Transformation in Industry

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405313539

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Cites: 6

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Related to: 10