Mechanical Sample Preparation for Heterogeneous Integration(HI) Packaging
Year: 2024
Type: conference-paper
Authors: Chengjie Xi, M Shafkat M Khan, Nitin Varshney, Aslam A Khan, Chris Richardson, Navid Asadizanjani
Institution: University of Florida
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405440646