Work

One-dimensional Cu–Ni core–shell composites as liquid epoxy molding compound fillers for enhanced heat dissipation and electromagnetic interference shielding in high-bandwidth memory

Year: 2024

Type: article

Source: Journal of Materials Chemistry C

DOI: 10.1039/d4tc04621h

Authors: Minkyu Kang, Minjun Bae, Sungho Cho, Yonghwan Kim, Kanghun Kim, Jonghyock Park, Won Young An, Dohyeong Kim, Yujin Chang, Kyurim Kim, Shuqing Piao, Yongyeol Park, Yuanzhe Piao

Institutions: Seoul National University, Advanced Institute of Convergence Technology

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: EMI, Ministry of Education, Ministry of Trade, Industry and Energy, National Research Foundation of Korea

Awards: G1076334834, G1258429911, G3538514451, G3882944329, G4094034583, G490042019, G4957235002

OpenAlex ID: W4405442726

FWCI: 0.475

Cites: 35

Cited by: 5

Related to: 10