Work

A Dynamic Junction Temperature Estimation Method of Power Semiconductor Devices Based on Case Temperature Feedback

Year: 2024

Type: conference-paper

DOI: 10.1109/isesc63657.2024.10785365

Authors: Jie Cai, Xi Zheng, Rui Xiang, Wenshan Xiao, Pu Chen, Hua Yin

Institution: China Electronics Technology Group Corporation

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4405491831

FWCI: 1.599

Cites: 14

Cited by: 2

Related to: 10