A Junction Temperature Monitoring Method with Miller Plateau based on Principal Component Analysis and Artificial Neural Networks
Year: 2024
Type: conference-paper
Authors: Shengjie Luo, Bo Yang, Yi Zhao, Letian Xiang, Xingjian Shi, Bin Yu, Haoze Luo, Wuhua Li
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405491892