Work

Junction Temperature Estimation Method for Press-pack IGBTs Using Double-side Thermal Resistance Network Model

Year: 2024

Type: conference-paper

DOI: 10.1109/isesc63657.2024.10785298

Authors: Liuyu Tu, Lin Liang, Li Wang, Ziyang Zhang, Zhiyuan Zhang, Kaijun Wen

Institutions: State Key Laboratory of Advanced Electromagnetic Engineering and Technology, Huazhong University of Science and Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405492087

FWCI: 1.612

Cites: 11

Cited by: 2

Related to: 10