Work

Advanced 3-D Packaging for Integrated 2-D PMUT Arrays and Front-End Circuits

Year: 2024

Type: conference-paper

DOI: 10.1109/uffc-js60046.2024.10793875

Authors: Alessandro S. Savoia, Monica La Mura, Mohammad Mahdi Dehghan Pir, Enrico Boni, Alessandro Ramalli, Piero Tortoli, Rahul Dutta, Vempati Srinivasa Rao, David Ho Soon, Carlo Luigi Prelini, Mark Shaw, Domenico Giusti

Institutions: Roma Tre University, University of Florence, Agency for Science, Technology and Research, Institute of Microelectronics, STMicroelectronics (Italy)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405517353

FWCI: 2.401

Cites: 10

Cited by: 3

Related to: 10