The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing
Year: 2024
Type: article
Authors: Chih-Cherng Liao, Jian-Hsing Lee, Yu-Jui Chang, Kai-Chuan Kan, Ching-Kuei Shih, Ya-Huei Kuo, Pei-Chen Tsai, Chien-Hsien Song, Ke-Horng Chen
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405521099