Highly efficient electroplating of (220)-oriented nano-twinned copper in methanesulfonic copper baths
Year: 2024
Type: article
Source: Materials Horizons
DOI: 10.1039/d4mh00680a
Authors: Hsiang-Sheng Wei, Hsu Tsou, Hao-Yu Ku, Chi-Yu Lai, Shih-Hua Chen, Chun-Cheng Lin, Shang-Tzu Liu, Hung-Yi Huang, Ming-Kun Lu, Kuan-Ling Liu, Chi-Chang Hu
Institution: National Tsing Hua University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405540136
