Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor
Year: 2024
Type: article
Abstract: Artificial intelligence (AI) 반도체는 인공지능 알고리즘 을 사용하여 여러 응용 프로그램을 실행하는 데 최적화된 반도체이다.
Authors: Chul Hwa Jung, Ji Won Park, Sung Jin Kim, Jae Pil Jung
Institution: University of Seoul
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Awards: G2109232652, G4298526978
OpenAlex ID: W4405550233