Comparative study of how buffering spacer materials affect the reliability of double-sided cooling SiC power module by finite element modeling
Year: 2024
Type: conference-paper
DOI: 10.1117/12.3056204
Authors: Jingyu Li, Xiaofei Pan, Zhifeng Shao, Xiankun Zhang, Sheng Gao, Sen Hong, Yi Huang, Yang Zuo
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405568184
