Work

Signal integrity analysis of chip package based on machine learning

Year: 2024

Type: conference-paper

DOI: 10.1117/12.3056084

Authors: Xiaobang Wu, Daoshuang Geng, Yang Liu, Chi Huang

Institution: Guilin University of Electronic Technology

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405568535

FWCI:

Cites: 10

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Related to: 10