Constructing Bilayer-type Layered Herringbone Packing in Dithieno[a,h]anthracenes for Solution-processable Organic Semiconductors
Year: 2024
Type: article
Source: ACS Applied Electronic Materials
Authors: Liang Zhang, Dong Xiao, Haoming Wei, Tengzhou Yang
Institution: Qufu Normal University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G1051681261, G6582732752
OpenAlex ID: W4405572859