Work

Development of Electrical and Optical Packaging for Silicon Photonic MEMS

Year: 2024

Type: conference-paper

Abstract: We demonstrate a packaging approach to integrate electrical and optical connections in silicon photonic MEMS, utilizing a custom-designed silicon interposer for routing over 118 electrical connections and a 72 channel fiber array to couple to on-chip fiber grating couplers with minimal transmission loss at 1543 nm wavelength.

Source: IEEE Photonics Conference

DOI: 10.1109/ipc60965.2024.10799857

Authors: Arun Kumar Mallik, Jun Su Lee, Sean Collins, Cleitus Antony, Umar Khan, Pierre Edinger, Gaehun Jo, Iman Zand, Frank Niklaus, Kristinn B. Gylfason, Niels Quack, Wim Bogaerts, Padraic E. Morissay, Peter O’Brien

Institutions: Tyndall National Institute, Ghent University, IMEC, KTH Royal Institute of Technology, École Polytechnique Fédérale de Lausanne

Language: English

Topic: Photonic and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

Funder: European Commission

Awards: G434337789, Mems-based zerO-power Reconfigurable PHotonic ICs

OpenAlex ID: W4405633333

FWCI: 0.779

Cites: 5

Cited by: 1

Related to: 10