Multi-channel Flip-chip RSOA InP-SiN ECL Array integrated on a 200mm Si Photonics Platform
Year: 2024
Type: conference-paper
Source: IEEE Photonics Conference
Authors: Hsiao-Lun Wang, Sulakshna Kumari, Damien Leech, Huseyin Sar, Negin Golshani, Dmitry Kazakov, Aleksandrs Marinins, Charles Caër, Yannick De Koninck, Stuart Smith, Andrew McKee, Sam Stephen, Sebastian Hänsch, Koen Kennes, Maumita Chakrabarti, Dimitrios Velenis, Peter Verheyen, Filippo Ferraro, Yoojin Ban, Joris Van Campenhout
Institution: IMEC
Language: English
Topic: Photonic and Optical Devices
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Delta
OpenAlex ID: W4405633455
