Work

Design of BGA style Glass Interposer for 2.5D integration of photonic ICs

Year: 2024

Type: conference-paper

Source: IEEE Photonics Conference

DOI: 10.1109/ipc60965.2024.10799522

Authors: D. S. Kumar, M. L. Hall, X. He, P. Morrissey, P. O’Brien, K. Kröhnert, Gunnar Böttger, M. Schiffer, M. Schneider-Ramelow, N. Schöning, M. Schulz-Ruthenberg, N. Ambrosius

Institutions: Tyndall National Institute, Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: HORIZON EUROPE Framework Programme

OpenAlex ID: W4405633655

FWCI: 1.612

Cites: 2

Cited by: 2

Related to: 10