Work

Silicon Etching Using Copper–Metal-Assisted Chemical Etching: Unveiling the Role of Cu 2 O in Microscale Structure Fabrication

Year: 2024

Type: article

Source: ACS Applied Materials & Interfaces

DOI: 10.1021/acsami.4c17500

Authors: Eunsol Lee, Sangseung Park, Gyeong-Su Park, Minisha Mehta, Lawrence Yoon Suk Lee, Changsoon Kim, In-Suk Choi

Institutions: Seoul National University, Daegu Gyeongbuk Institute of Science and Technology, Hong Kong Polytechnic University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Research Foundation of Korea

Awards: G1363466373, G204043374, G3531173902, G487419708

OpenAlex ID: W4405664363

FWCI: 1.041

Cites: 48

Cited by: 10

Related to: 10