Work

Multiobjective Optimization Study of Stacked BGA Solder Joints Under Coupled Bending-Vibration Load and Crosstalk Effects

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3520978

Authors: Liye Wu, Chunyue Huang, Jisheng Wei, Ying Liang, Chao Gao, Xianjia Liu, Zhiqin Cao

Institution: Guilin University of Electronic Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Foundation for Alcohol Research and Education

Awards: 棉花质量流量光学测量模型和试验研究, G4277330005, G9000012410

OpenAlex ID: W4405718375

FWCI: 0.52

Cites: 20

Cited by: 5

Related to: 10