Signal Integrity Analysis and Design for HBM3 on Silicon-Based 2.5D Packaging
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Institution: Advanced Semiconductor Engineering (Taiwan)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405754637