Work

Sintered Ag & Cu Based Die Attach for Power Package and Power Module Application

Year: 2024

Type: conference-paper

Source: IEEE CPMT Symposium Japan (ICSJ)

DOI: 10.1109/icsj62869.2024.10804715

Authors: Hideaki Tamimoto, Kazuki Matsumura, Kazuyuki Nakagawa, Kenji. Ikura, Chikara Obama

Institution: Renesas Electronics (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405754661

FWCI:

Cites: 4

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Related to: 10