Enhancing Adhesion and Peel Strength for Fine Line Design on FCCSP Package
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Authors: Rick Yeh, MJ He, Yu Cheng Pai, Carl Chen, Yu-Po Wang
Institution: Siliconware Precision Industries (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405754688