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Fluxless Low-Temperature Flip Chip Solder Interconnect for Cost Reduction

Year: 2024

Type: conference-paper

Source: IEEE CPMT Symposium Japan (ICSJ)

DOI: 10.1109/icsj62869.2024.10804728

Authors: Teck Kheng Lee, Kelvin Zheng, Kyu Sik Shim, Ngan Yeow Goh, Sandar Tun Khin

Institution: Institute of Technical Education

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405754699

FWCI:

Cites: 2

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Related to: 10