Work

Al Wiring and Cu Wiring Connection by Newly Established AL Ribbon Stack Bonding Technology for Power Package and Module

Year: 2024

Type: conference-paper

Source: IEEE CPMT Symposium Japan (ICSJ)

DOI: 10.1109/icsj62869.2024.10804756

Authors: Noriko Numata, Takashi Aoki, Koichi Hasegawa, Manabu Nejiki, Ken Yamamura, Kazuyuki Nakagawa

Institution: Renesas Electronics (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405754705

FWCI:

Cites: 2

Cited by:

Related to: 10