Work

Advanced Reliability Assessment Approach of Power Modules Under Low-Cycle Thermal Fatigue Through Redefined 3-D J-Integral

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3522123

Authors: Jaejin Jeon, Sang Won Yoon

Institution: Seoul National University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

Funder: National Research Foundation of Korea

Awards: G1299059172, G3400234590

OpenAlex ID: W4405755173

FWCI: 0.416

Cites: 35

Cited by: 4

Related to: 10