Thermally Stable Solder Resist for High Temperature Applications
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Authors: Daisuke Shibata, Kazuya Nobuta, Daichi Okamoto, Masayuki Shimura, Yuya Suzuki
Institution: Taiyo INK MFG. Co., Ltd. (Japan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405755246