Work

Five-sided Protection of the Chip with Bump Support Film Impact Resistance

Year: 2024

Type: conference-paper

Source: IEEE CPMT Symposium Japan (ICSJ)

DOI: 10.1109/icsj62869.2024.10804672

Authors: Reina Kainuma, Rikiya Kobashi, Keisuke Shinomiya, Takuo Nishida

Institution: Lintec Corporation (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405755257

FWCI: 0.806

Cites: 8

Cited by: 1

Related to: 10