Comparative Studies on the Reliability and Intermetallic Integrity of Novel Au-Coated Ag Versus Cu and Au Bonding Wires
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Authors: Randolph Flauta, Jorex Lumanog, Suqin Huang, Joe Zhou, King Man Tai, Moon Chen
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405755283