High Density, High Bandwidth Copper Interconnects to Support High Density IC Packaging
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Authors: Osamu Shimizu, Steve Krooswyk, Andy Shrout, Jignesh Shah, Akinori Mizumura, Chad Faith, Janine Love, Kevin Burt
Institution: New York State Library
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405755394