Heat Dissipation Study of Sub-THz Band AiP Module
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Authors: Makoto Tsukahara, Kei Murayama, Hiroko Ota, Hiroshi Taneda, Yoichi Nakagawa
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405755764