High-Performance Flip-Chip BGA Packages Reliability Prediction in Automotive Applications
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Authors: Bo-Heng Chen, Wei-Hong Lai, Chin-Li Kao, Alexcc Wang, CP Hung
Institution: Advanced Semiconductor Engineering (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405755829