Work

Effect of Microstructure on the Electromigration Performance of 2- μm-Cu Redistribution Line under In-situ SEM Observation

Year: 2024

Type: conference-paper

Source: IEEE CPMT Symposium Japan (ICSJ)

DOI: 10.1109/icsj62869.2024.10804753

Authors: Min-Yan Tsai, Ting-Chun Lin, Yen-Cheng Huang, Shan-Bo Wang, Yung-Sheng Lin, Kwang-Lung Lin

Institutions: Advanced Semiconductor Engineering (Taiwan), National Cheng Kung University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Cheng Kung University Hospital

OpenAlex ID: W4405755917

FWCI: 10.67

Cites: 8

Cited by: 6

Related to: 10