Novel Additive Manufacturing Platform for Freeform 3D Microelectronics and Packaging
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Institution: Holst Centre (Netherlands)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405755919
