Wearable Electronic Packaging Technology for VR and Biomedical Applications
Year: 2024
Type: conference-paper
Source: IEEE CPMT Symposium Japan (ICSJ)
Author: Seiichi Takamatsu
Institution: Binghamton University
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405756330