Work

Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks

Year: 2024

Type: article

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

DOI: 10.1109/tcad.2024.3522878

Authors: Seunghyun Hwang, Michael Joseph Smith, Vinicius C. Do Nascimento, Qiang Qiu, Cheng-Kok Koh, Ganesh Subbarayan, Dan Jiao

Institution: Purdue University West Lafayette

Language: English

Topic: Model Reduction and Neural Networks

Subfield: Statistical and Nonlinear Physics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Foundation

OpenAlex ID: W4405778575

FWCI:

Cites: 26

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Related to: 10