Work

Hybrid Computational Intelligence Framework With Enhanced Features Analysis to Predict the Fatigue Life of Critical Components in a PCB

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3522331

Authors: Akashjyoti Barman, Tejas Alisyam, Sudha Radhika, G. R. Sabareesh

Institutions: Birla Institute of Technology and Science - Hyderabad Campus, Birla Institute of Technology and Science, Pilani

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Defence Research and Development Organisation

Award: G5641393970

OpenAlex ID: W4405778858

FWCI: 0.103

Cites: 36

Cited by: 1

Related to: 10