Work

Surface-Treated Three-Dimensional Boron Nitride Epoxy Composite Dielectric for Smartphone-Printed Circuit Board Application

Year: 2024

Type: article

Source: ACS Applied Engineering Materials

DOI: 10.1021/acsaenm.4c00701

Authors: Jae Man Park, Tae Hyun Kwon, Young Jo Kim, Moon Sung Kang

Institutions: Sogang University, LG (South Korea), University of New Hampshire

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405800872

FWCI: 0.384

Cites: 67

Cited by: 4

Related to: 10