Work

A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3522315

Authors: Shaoyi Liu, Song Xue, Jianlun Huang, Hao Wang, Zhihai Wang, Congsi Wang

Institutions: Xidian University, Hefei Meiling (China)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China, National Defense Basic Scientific Research Program of China

Awards: G3909190240, G4721295255, G5589784108, G7045081148

OpenAlex ID: W4405811874

FWCI: 0.308

Cites: 33

Cited by: 3

Related to: 10