Work

Investigation on Indium Thermal Interface Materials Fluxless Bonding Technology via In Situ Formed AgIn₂ Coating

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3522254

Authors: Jing Wen, Yi Fan, Guoliao Sun, Jinyang Su, Linzheng Fu, Zhuo Chen, Wenhui Zhu

Institutions: Central South University, State Key Laboratory of High Performance Complex Manufacturing

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Science and Technology Bureau, Changsha

Award: G5460260634

OpenAlex ID: W4405811953

FWCI: 0.312

Cites: 26

Cited by: 3

Related to: 10