Heat Dissipation Performance of Vapor Chamber for Semiconductor Chip Cooling
Year: 2024
Type: article
Abstract: A vapor chamber with excellent heat transfer was developed by injecting water in a vacuum and utilizing the high heat of vaporization generated from the phase transformation from liquid to gas. To evaluate the vapor chamber cooling performance, the heat sink surface was heated and subjected to forced convection using a fan to maintain the steady state. Compared to a pure copper heat sink, the heat sink using the vapor chamber showed superior heat dissipation performance under the same experimental conditions. The performance of the vapor chamber is closely related to the degree of vacuum, and it demonstrated superior performance in products with a high degree of vacuum.
Authors: Jeong-hwan Seo, Sung-woo Jin
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4405824867